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1 1111111111111111111111111111111 1111111111111111111111111111 (1 9 ) U n ite d S ta te s ( 1 2 ) P a t e icn at t Ao pnl pic Pa ut ibo n l i W e b b e t a l. (54) HIGH SPEED COPPER PLATING BATH (75) Inventors: Eric Webb, Moses Lake, WA (US); Xingling Xu, Moses Lake, WA (US) U S 20100276292A 1 (1 0 ) P u b . N o .: U S 2 0 1 0 /0 2 7 6 2 9 2 A l (4 3 ) P u b . D a te : (22) Filed: Apr. 30, 2009 Publication Classification (51) Int. Cl. C25D 3/66 (2006.01) 205/230; 204/243.1 ABSTRACT N ov. 4, 2
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  111111111111111111111111111111111111111111111111111111111111 US 20100276292A1 (19) United States (12) Patent App li cation Pub li cation(10) Pub. No.: US 2010/0276292 Al Webb et al.(43) Pub. Date:Nov. 4, 2010 (54) HIGH SPEED COPPER PLATING BATH(75) Inventors: Eric Webb, Moses Lake, WA (US);Xingling Xu, Moses Lake, WA (US) Correspondence Address:  NUTTER MCCLENNEN & FISH LLP SEAPORT WEST, 155 SEAPORT BOULEVARD BOSTON, MA 02210-2604 (US) (73) Assignee: Moses Lake Industries Inc., Moses Lake, WA (US)(21) Appl. No.:12/433,657 (22) Filed: Apr. 30, 2009 Publication Classification (51) Int. Cl. C25D 3/66 (2006.01) (52) U.S. Cl ... 205/230; 204/243.1 (57) ABSTRACT A copper electroplating bath that includes an aqueous solu-tion that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is dis- closed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aque- ous solution at saturation levels while retaining the copper  saltin solid form within the container. n V  Patent Application Publication  Nov. 4, 2010 FIG.1A 34 3 36 FIG.1B Sheet 1 of 3 US 2010/0276292 Al 34. 32 00 0 34 34 40 36 ��30 32 34 36  r  Patent Application Publication  Nov. 4, 2010Sheet 2 of 3 PROVIDE COPPER  ELECTROPLATING BATH PROVIDE SUBSTRATE PLACE SUBSTRATE IN COPPER  ELECTROPLATING BATHELECTROPLATE COPPER  ON SUBSTRATE FIG.2 US 2010/0276292 Al 100 720  Patent Application PublicationNov. 4, 2010Sheet 3 of 3US 2010/0276292 Al FIG.3 m E E M E M M M M I, FIG.4
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